Introduction:In semiconductor manufacturing, fully automated wafer defect inspection during the early stages is critically important. In the backend process, multiple wafers are often bonded together or attached to opaque materials. Since semiconductor materials are opaque to visible light, it is difficult to characterize or inspect the bonding quality or contamination on bonding surfaces using visible…
Introduction Since the early 1990s, there has been a worldwide surge of interest in the development of high-brightness light-emitting diodes (LEDs), which has significantly advanced the field of solid-state lighting. High-brightness LEDs commonly adopt double heterostructures, necessitating excellent lattice matching between materials. This requirement imposes stringent limitations on the choice of semiconductor systems suitable for…
